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Design Guidelines Source: dcchapters.ipc.org
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Short Description: Testability Design Guidelines. In-Circuit Testing. In establishing test points on the PCB solder side, three major areas need to be considered in ...

Content Inside: DG-001 Rev. 1.04 Document Outline1. Manufacturing Strategy1.1 Assembly Strategy1.1.1 Industry Trends1.1.2 Long Range Plans1.2 Test Strategy1.2.1 Test Plan/Sequence1.3 New Product Industrialization1.3.1 Manufacturability Review Elements1.3.2 Equipment Capability Overview Stencil Printing1.3.3 SMT Placement1.3.4 Reflow1.3.5 DIP Insertion1.3.6 Axial Insertion1.3.7 Radial Insertion1.3.8 Contact Systems1.3.9 Component preparation/lead forming1.3.10 Wave Solder1.3.11 Cleaning1.3.12 Board Transfer System1.3.13 In-Circuit Test1.3.14 Functional Test1.3.15 Burn-In & Environmental1.3.16 Coating and Potting1.3.17 Plastic Molding1.3.18 Wire/Cable/Terminal Processing1.4 Workmanship Standards1.4.1 Overview2. PCB Design2.1 Land Patterns2.1.1 General Considerations2.1.2 Via Sizes (does not apply to test points)2.1.3 Standard SMT Parts2.1.4 Fine Pitch SMT Parts2.1.5 Rules for New SMT Packages2.1.6 Through Hole Parts2.2 Design Rules2.2.1 Placement Rules2.2.1.1 Top Side SMT Reflow2.2.1.2 Bottom side SMT Wave Solder2.2.1.3 DIP Auto-Insertion Top Side Spacing2.2.1.4 DIP Auto-Insertion Bottom Side Clinch Spacing2.2.1.5 Axial Auto-Insertion Top Side Assembly2.2.1.6 Axial Auto-Insertion Bottom Side Clinch Spacing2.2.1.7 Radial Top Side Auto-Insertion Assembly2.2.1.8 Post Wave Solder Manually Manually Inserted Components2.2.1.9 Process Clearances Through Wave Solder2.2.1.10 Height Rules for Hand Soldering2.2.2 Board Routing2.2.2.1 Trace to Trace Spacing2.2.2.2 Trace to Pad/Land Spacing2.2.2.3 Vision Targets2.2.2.4 IPC Standard Patterns2.2.3 Multilayer Boards2.2.3.1 Border on Plane Layers2.2.3.2 Thermal Reliefs for SMT and IMT2.2.4 Ground Plane on Outer Layers2.2.5 Board Identification2.2.5.1 UL Mark2.2.5.2 Board Part Number2.2.5.3 Artwork Number and Revision2.3 Panelization2.3.1 Panel and Board RequirementsPanel Design2.3.1.2 Depanelization Approaches2. Break-Away Tab Design2. Routed Panel2. Scored Panel2.4 Design for Testing2.4.1 Test Plans and Test Specifications2.4.2 Test Sequence2.4.3 Testability Design Guidelines2.4.3.1 In-Circuit Testing2.4.3.2 Mechanical Considerations2.4.3.3 Electrical Considerations2.4.4 Functional Testing2.5 Coating2.5.1 Product Design ConsiderationsPotting2.6.1 System Capabilities:3. Documentation3.1 Design Documentation Set3.2 Assembly Drawings3.3 Bills of Material3.4 Purchased Part Drawings3.5 Schematic Drawings3.6 PCB Panel Fabrication Drawings3.7 PCB Data/Files3.8 Programmed Part Drawings/Files3.9 Test Plans and Test Specifications3.10 Packaging Specifications3.11 Special Workmanship Standards3.12 Engineering Change Orders4. INDEX


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